发明名称 FILM FORMING METHOD AND FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a film forming method in which the intra-plane uniformity of film thickness can be improved. SOLUTION: In the film forming method for forming a thin film on the surface of an object W to be treated by supplying film forming gases into a treatment container 38 in which evacuation is performed, the method has a process for preheating immediately before supplying the film forming gases into the treatment container. In such a case, the method has a supply rate determining film forming process for forming the film in a supply rate determining state in the treatment container, for example, and a reaction rate determining film forming process for forming the film in a reaction rate determining state within the treatment container. thus, the film forming gases supplied into the treatment container are preheated and activated such that the reaction of the film forming gases can be promoted. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003209099(A) 申请公布日期 2003.07.25
申请号 JP20020005826 申请日期 2002.01.15
申请人 TOKYO ELECTRON LTD 发明人 CHIBA TAKASHI;KATO HISASHI
分类号 B01J19/00;C23C16/455;H01L21/31;(IPC1-7):H01L21/31 主分类号 B01J19/00
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