| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus having sufficient resistance against intrusion of moisture so as to prevent a defect of image due to exfoliation. SOLUTION: The solid-state imaging apparatus 20 is mainly configured with: a solid-state imaging device chip 21; a CCD cover glass plate 22 being a cover member; and a circuit board 23 electrically connected to the solid-state imaging device chip 21. An adhesive layer 26 is provided between the solid-state imaging device chip 21 and the CCD cover glass plate 22, and a side face 21s of the solid-state imaging device chip 21 and a side face 22s of the CCD cover glass plate 22 are positioned and placed while being flush with each other. The CCD cover glass plate 22 and a thin thickness reinforcing member 27 made of a glass member of the same type of material as that of the CCD cover glass plate 22 are integrally adhered over both of the side faces 21s, 22s at sides (3 sides at maximum) not arranged with a bonding pad section 25 by a thermosetting type semiconductor sealing resin, and an inner lead part 23d of the circuit board 23 is coated by a sealing resin 28. COPYRIGHT: (C)2003,JPO
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