发明名称 BONDING HEAD AND PACKAGING UNIT
摘要 PROBLEM TO BE SOLVED: To provide a bonding head and a packaging unit equipped with the bonding head that can replace a jig retaining an electronic component with a jig of proper size according to a size or the like of the electronic component while keeping the transfer efficiency of ultrasonic energy. SOLUTION: A fitting recess is provided on a horn 61, a fitting protrusion 652 is provided on a suction nozzle 65, external force is applied to the fitting recess to deform it as if its diameter is made larger, and then the external force is relieved after imposing the fitting protrusion 652 of the suction nozzle 65, by which the fitting recess of the suction nozzle 65 is tightened and fixed by restoring force produced by the elasticity of a material constituting the horn 61 deformed by the external force. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003209142(A) 申请公布日期 2003.07.25
申请号 JP20020008270 申请日期 2002.01.17
申请人 SONY CORP 发明人 YATSUGAYO SEIICHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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