| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition for a lift off process of which the end of the cured film formed under a wide range of resist film thickness conditions has an overhanging or back taper-like shape and in which an angle θ formed by the surface inclusive of the line intersecting the top surface and flank of the film at the end of the cured film and the line insecting the bottom end and a base material with the base material surface exposed by development can be easily controlled to a desired range and the fine reproduction of conductor patterns, etc., is possible. <P>SOLUTION: The photosensitive resin composition contains (A) photopolymerization initiator components containing at least one photopolymerization initiator selected from the following group (a) and at least one photopolymerization initiator selected from the following group (b) in such a manner that the weight ratio of (a):(b) attains 1:10 to 10:1; (a) benzophenones, thioxanthons, biimidazoles; (b) acetophenons, acylphosphineoxides, (B) an alkali-soluble resin and (C) a diluting agent. <P>COPYRIGHT: (C)2003,JPO |
