发明名称 PROCESSING DEVICE AND TREATMENT METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To respond needs of restraining the amount of treatment liquid consumption while miniaturizing and simplifying a device and, further, reducing the amount of grinding in a grinding process or eliminating the grinding process itself even when a film is formed on the surface of a substrate having a recessed and projected pattern. SOLUTION: The substrate treatment device is equipped with a substrate holder 12 for detachably retaining the substrate 10, a flat plate 14 having a flat surface unit 14a arranged at a position facing the surface 10a of the substrate 10 retained by the substrate holder 12, and a moving mechanism 20 for moving the flat plate 14 with a small step to change a distance g between the substrate 10 retained by the substrate holder 12 and the flat plate 14. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003209039(A) 申请公布日期 2003.07.25
申请号 JP20020005057 申请日期 2002.01.11
申请人 EBARA CORP;TOSHIBA CORP 发明人 SHINOZAKI HIROYUKI;ITO SHINICHI;EMA TATSUHIKO
分类号 G03F7/30;B05C11/08;B05D1/40;H01L21/027;H01L21/31;(IPC1-7):H01L21/027 主分类号 G03F7/30
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