摘要 |
An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid. |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
DUBOUSE, ALAIN;LIU, FENG, Q.;WANG, YAN;CHEN, LIANG-YUH;SUN, LIZHONG;WANG, YUCHUN;NEO, SIEW |