| 摘要 |
The present invention is a method for forming a metal layer on an IC package which is applied to an IC package comprising a substrate and at least one chip on the substrate; the chip couples with the substrate via wire-bonding, flip-chip, etc.; further, an encapsulation covers at least on the chip and around the chip on the substrate; a metal-spraying layer is formed on partial non-conducting area of the IC package; a protective film can be optionally coated on the metal-spraying layer for protecting the metal-spraying layer; a thickness of the metal-spraying layer is decided depending on needs and easily changed to reach heat-dissipating and EMI shielding functions.
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