发明名称 Stacked capacitor for a semiconductor device and a method of fabricating the same
摘要 The disclosure describes a stacked capacitor and a method of forming the same. The method prevents a storage node of the stacked capacitor from crumbling due to lack of support, thereby improving the reliability of semiconductor devices that incorporate stacked capacitors. The disclosure also describes a stacked capacitor with a greater capacitance than a stacked capacitor in accordance with the conventional art.
申请公布号 US2003136996(A1) 申请公布日期 2003.07.24
申请号 US20020313249 申请日期 2002.12.06
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 PARK DONG-GUN
分类号 H01L21/8242;H01L21/02;H01L27/10;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/8242
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