发明名称 |
CMP slurry additive for foreign matter detection |
摘要 |
A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.
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申请公布号 |
US2003139048(A1) |
申请公布日期 |
2003.07.24 |
申请号 |
US20020056387 |
申请日期 |
2002.01.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WONG KWONG HON;BOGGS KARL E.;MITCHELL RAPHAEL;ZIEMINS ULDIS A. |
分类号 |
B08B3/00;B08B3/02;B24B37/04;H01L21/306;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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