发明名称 Metal polishing slurry having a static etch inhibitor and method of formulation
摘要 A metal polishing slurry having a static etch inhibitor and method for polishing a substrate while inhibiting static etching during the polishing of a substrate. The slurry composition includes an iodate-free halogenated inhibiting compound added to a generic slurry to form a resultant slurry. The substrate is polished using the resultant slurry, which inhibits the static etching of the substrate being polished. Also provided is a metal polishing slurry for inhibiting static etch comprising an oxidizer, a complexing agent, and an iodate-free halogenated inhibiting compound.
申请公布号 US2003139047(A1) 申请公布日期 2003.07.24
申请号 US20020056342 申请日期 2002.01.24
申请人 THOMAS TERENCE M.;DENARDI STEPHAN;GODFREY WADE 发明人 THOMAS TERENCE M.;DENARDI STEPHAN;GODFREY WADE
分类号 B24B37/00;C09G1/02;C09K3/14;C23F3/00;H01L21/304;H01L21/306;H01L21/321;(IPC1-7):H01L21/302;H01L21/461 主分类号 B24B37/00
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