| 摘要 |
<p>A thin lightweight heat sink having high-efficiency cooling capacity which can deal with a high-heat-generation semiconductor device, and a semiconductor comprising the heat sink. The heat sink for semiconductor device comprises a base section having a first face arranged with a plurality of heat dissipation fins and a second face touching a semiconductor device directly, and a heat spreader arranged on the second face of the base section so as not to touch the semiconductor device directly.</p> |
