HEAT SINK FOR SEMICONDUCTOR COMPONENTS OR SIMILAR DEVICES, METHOD FOR PRODUCING THE SAME AND TOOL FOR CARRYING OUT SAID METHOD

摘要

The invention relates to a heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. Said heat sink comprises cooling ribs (20) which rise at a distance from a base plate (12) and which are clamped in an insert groove made in the surface of the base plate (12), laterally limited by longitudinal or intermediate ribs with a coupling base (24) that has an approximately rectangular cross-section. The coupling bases (24) are held in their insert grooves in a form-fit and are cold-welded with the base plate (12) at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base (24) in a form-fit.