| 摘要 |
According to the present invention, there is provided a polishing pad for polishing the surface of wafers for creating semiconductor integrated circuits, wherein said pad has a high polishing speed, said polishing is uniform, and said pad has a long life. Preferably, the polishing pad of the present invention comprises nonwoven fabric (base matrix) and a nonporous photo-setting resin that fills the space between the nonwoven fabric, and can be produced by impregnating the base matrix with a photo-sensitive resin composition containing at least one selected from the group consisting of a hydrophilic photopolymeric polymer or oligomer, and/or a hydrophilic photopolymeric monomer, and then photo-setting the same. <IMAGE> |
