Method of manufacturing electronic part, electronic part and electroless plating method

摘要

A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni-P film on an electrode made of Cu, Ag or Ag-Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni-P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.