发明名称 |
Method and apparatus for applying downward force on wafer during CMP |
摘要 |
An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
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申请公布号 |
US2003139115(A1) |
申请公布日期 |
2003.07.24 |
申请号 |
US20010033671 |
申请日期 |
2001.12.27 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
DE LA LLERA ANTHONY;PHAM XUYEN;SIU ANDREW;NGUYEN TUAN A.;LUONG TONY |
分类号 |
B24B37/00;B24B37/04;B24B49/16;H01L21/304;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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