发明名称 |
Radiation-curable compositions and related methods for the assembly and repair of optical components and products prepared thereby |
摘要 |
Improved radiation-curable compositions and related methods useful in the assembly of optical components. These compositions cure via free-radical polymerization and comprise: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % adhesion promoter, wherein the cured composition exhibits a modulus of less than about 50 MPa, and a dry adhesion in excess of about 50 g force. A related aspect of the present invention is a higher modulus composition that cures via free-radical polymerization and comprises: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % polymerizable adhesion promoter, wherein the cured composition exhibits a modulus of greater than about 600 MPa.
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申请公布号 |
US2003139487(A1) |
申请公布日期 |
2003.07.24 |
申请号 |
US20020284906 |
申请日期 |
2002.10.31 |
申请人 |
DSM N.V. |
发明人 |
MONTGOMERY EVA I.;DAKE KENNETH;KRONGAUZ VADIM V. |
分类号 |
G02B6/44;C03C25/10;C03C27/10;C08F290/06;C08G18/67;C09D4/00;C09D4/06;C09D175/16;C09J4/00;C09J175/16;(IPC1-7):C08G2/00 |
主分类号 |
G02B6/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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