| 摘要 |
<p>A soldering method, wherein the rate of decrease of an oxidation suppressing element in a soldering bath is measured during operation of the bath, and a solder alloy containing the oxidation suppressing element in an amount equal to or more than the amount calculated from the above rate of decrease is additionally supplied to the bath. In n embodiment, a flow soldering method using an Sn-Ag or Sn-Ag-Cu based solder alloy, wherein a solder alloy having an Sn-Ag or Sn-Ag-Cu based solder alloy and 60 to 100 mass ppm of P is supplied to a soldering bath for compensating the decrease of the P content in the soldering bath observed during the operation thereof, to maintain the P content. The soldering method allows the reduction of the variation of the P content in a solder bath, which leads to the improvement of soldering quality.</p> |
