| 摘要 |
<p>The embossing die (61) according to the invention comprises an embossing surface and ridge shaped protrusions (61.1) protruding from this surface. The ridge shaped protrusions (61.1) serve for forming groove shaped indentations into a dielectric substrate during an embossing process. These groove shaped indentations serve for being filled with conducting material during a subsequent plating step, which conducting material may serve as conductor path. In addition to the ridge shaped protrusions, also peg shaped or cone shaped protrusions (61.2) for pre-forming through connections etc. may be present. At least a part of the embossing die (61) comprising the embossing surface and the protrusions are made from one piece of material, namely from an amorphous metal.</p> |
