发明名称 AQUEOUS STRIPPING AND CLEANING COMPOSITION
摘要 The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water.
申请公布号 WO03060045(A1) 申请公布日期 2003.07.24
申请号 WO2003US00291 申请日期 2003.01.06
申请人 ASHLAND INC. 发明人 EGBE, MATTHEW, I.;PETERS, DARRYL, W.
分类号 B08B3/08;C09D9/00;C11D1/14;C11D1/22;C11D3/34;C11D3/43;C11D7/26;C11D7/32;C11D7/34;C11D7/50;C11D11/00;C23G5/02;G03F7/42;H01L21/02;H01L21/3213;H05K3/26;(IPC1-7):C11D1/62;C23G1/00;C23G1/02;C03C23/00;B08B3/00;B08B3/12;B08B6/00 主分类号 B08B3/08
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