| 摘要 |
<p>A method for material processing utilizing a material processing system ( 1 ) to perform a process. The method a process, measures a scan of data, and transforms the data scan into a signature including at least one spatial component. The scan of data can include a process performance parameter ( 14 ) such as an etch rate, an etch selectivity, a deposition rate, a film property, etc. A relationship can be determined between the measured signature and a set of at least one controllable process parameter ( 12 ) using multivariate analysis, and this relationship can be utilized to improve the scan of data corresponding to a process performance parameter. For example, utilizing this relationship to minimize the spatial components of the scan of data can affect an improvement in the process uniformity.</p> |
