发明名称 Electrical apparatus
摘要 The electrical equipment has a circuit on a carrier plate, and a stamped grid forming the electrical connections between the circuit and further electrical components. The carrier plate (12) is in thermally conductive contact with at least a part (10) of the stamped grid (7). The electrical insulation between the carrier plate and the grid is a film (15) with double adhesive sides or a screen printed adhesive. The grid is shrouded by an injection molded plastics (8), leaving free the electrical contact surfaces and thermally conductive surfaces.
申请公布号 EP1330148(A2) 申请公布日期 2003.07.23
申请号 EP20030000756 申请日期 2003.01.13
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 DOERRHOEFER, STEFAN;NITZSCHE, MICHAEL;SCHULTZ, DIETMAR
分类号 H01L23/12;H01L23/36;H05K1/02;H05K3/00;H05K5/00;H05K7/20;(IPC1-7):H05K5/00 主分类号 H01L23/12
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