发明名称 |
Electrical apparatus |
摘要 |
The electrical equipment has a circuit on a carrier plate, and a stamped grid forming the electrical connections between the circuit and further electrical components. The carrier plate (12) is in thermally conductive contact with at least a part (10) of the stamped grid (7). The electrical insulation between the carrier plate and the grid is a film (15) with double adhesive sides or a screen printed adhesive. The grid is shrouded by an injection molded plastics (8), leaving free the electrical contact surfaces and thermally conductive surfaces. |
申请公布号 |
EP1330148(A2) |
申请公布日期 |
2003.07.23 |
申请号 |
EP20030000756 |
申请日期 |
2003.01.13 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DOERRHOEFER, STEFAN;NITZSCHE, MICHAEL;SCHULTZ, DIETMAR |
分类号 |
H01L23/12;H01L23/36;H05K1/02;H05K3/00;H05K5/00;H05K7/20;(IPC1-7):H05K5/00 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|