Plastic Moulded Package for a Semiconductor Device

摘要

A semiconductor device accommodation package (1) is resin-molded from a plastic material into a hollow box shape. A conductive circuit pattern (4) including a microstrip line connected electrically to a semiconductor device (5) is fitted three-dimensionally by patterning in multiple layers on the surface of the package (1) and is connected to protuberances (3) of electrode lead terminals. Heat radiation fins (2) and the protuberances (3) are molded integrally with the package (1) at the time of resin-molding of the package (1).