发明名称 |
SEGMENTED WAFER POLISHING PAD |
摘要 |
Working plate (10) is formed of forty-eight sections (10'), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10') attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19). |
申请公布号 |
EP1328377(A1) |
申请公布日期 |
2003.07.23 |
申请号 |
EP20010976480 |
申请日期 |
2001.10.19 |
申请人 |
H K FOUNDERS LTD |
发明人 |
MIDDLETON, STEPHEN VICTOR;KRUGER, JOHN EDMUND LEIGH |
分类号 |
B24B37/04;B24B37/26;B24D7/06;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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