发明名称 |
Accuracy analyzing apparatus for machine tool |
摘要 |
The present invention relates to an accuracy analyzing apparatus which is capable of efficiently analyzing accuracies of a machine tool including the perpendicularity of a spindle axis and the thermal displacement of a spindle with a higher level of accuracy at lower costs. The accuracy analyzing apparatus (1) comprises a laser oscillator (2) attached to the spindle (26) for emitting a laser beam having a light axis perpendicular to the spindle axis, an imaging device (5, 8) having a light receiving section (5) disposed in the vicinity of the laser oscillator (2) for receiving the laser beam from the laser oscillator (2) by the light receiving section (5) and generating two-dimensional image data, and an analyzer (15) for analyzing the accuracies of the machine tool (20) on the basis of the generated image data. <IMAGE>
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申请公布号 |
EP1329688(A2) |
申请公布日期 |
2003.07.23 |
申请号 |
EP20030000534 |
申请日期 |
2003.01.09 |
申请人 |
MORI SEIKI CO., LTD.;INTELLIGENT MANUFACTURING SYSTEMS INTERNATIONAL |
发明人 |
FUJISHIMA, MAKOTO |
分类号 |
B23Q17/22;B23Q17/24;G01B11/00;G01B11/26;G01B11/27;(IPC1-7):G01B11/27 |
主分类号 |
B23Q17/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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