| 摘要 |
An electrode pad PAD, which is a layer 11 substantially made of aluminum to be connected to an internal conductive region, is formed on an interlayer insulation film 10 made of an SiO2 layer or the like so as to be exposed in an opening portion of a passivation film 12 as the uppermost layer. For example, a bonding wire not shown in the drawing is connected to the electrode pad PAD. The exposed surface of the electrode pad PAD comprises a rough surface R roughened by means of an etching solution. Thereby, the surface of the electrode pad PAD has a substantially constant roughness, which increases the contact area for the bonding wire not shown in the drawing.
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