发明名称 Multilayered board and method for fabricating the same
摘要 A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof. The glass-containing insulating layer is formed by firing a layer containing 60% by volume or less of a glass component before firing, a portion of the glass component is segregated in the surface region of the glass-containing insulating layer by firing, and the electrode is bonded to the surface of the glass-containing insulating layer by means of the segregated glass component. A method for fabricating a multilayered board is also disclosed.
申请公布号 US6596382(B2) 申请公布日期 2003.07.22
申请号 US20010906016 申请日期 2001.07.11
申请人 MURATA MANUFACTURING CO. LTD. 发明人 KAWAKAMI HIROMICHI
分类号 H05K1/09;H01L23/15;H01L23/498;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B32B3/00 主分类号 H05K1/09
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