发明名称 |
Bonding apparatus and bonding method of optical disks |
摘要 |
An optical-disk bonding apparatus for bonding two or more disk substrates with an adhesive, has a turning table for clamping the disk substrates; a thickness gauge for measuring a thickness of bonding layers; and a rotation control unit for controlling the turning of a turning table; wherein the thickness of the bonding layers is measured with the thickness gauge on the turning table; and a rotation of the turning table or the pressure acting on the disk substrates is controlled based on the measured thickness data.
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申请公布号 |
US6596104(B1) |
申请公布日期 |
2003.07.22 |
申请号 |
US20000690966 |
申请日期 |
2000.10.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOMIYAMA MORIO |
分类号 |
B29C35/08;B29C65/00;B29C65/48;G11B7/26;(IPC1-7):B32B31/10 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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