Manufacturing use of photomasks with an opaque pattern comprising an organic layer photoabsorptive to exposure light with wavelengths exceeding 200 NM

摘要

A method is provided for well printing a specified pattern even when the exposure treatment using a resist mask uses exposure light with a wavelength over 200 nm. When exposure treatment is applied to a semiconductor wafer by using exposure light with a wavelength over 200 nm, a photomask is used. The photomask is provided with an opaque pattern of a resist layer on an organic layer which is photoabsorptive in reaction to exposure light.