发明名称 |
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
摘要 |
An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
|
申请公布号 |
US6595408(B1) |
申请公布日期 |
2003.07.22 |
申请号 |
US19980167763 |
申请日期 |
1998.10.07 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
COBBLEY CHAD A.;BALL MICHAEL B.;WADDEL MARJORIE L. |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):B23K35/12;B23K1/00;B23K31/02;B23K3/30;H05K3/30 |
主分类号 |
B23K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|