| 摘要 |
A semiconductor device includes a passivation film (19) having opening portions through which an electrode pads (18) formed on a semiconductor chip (21) are exposed, projecting electrode portions (20) whose one end faces are connected to the electrode pads (18) through the opening portions, post electrode portions (16A) through which the other end faces of the projecting electrode portions (20) and the metal bumps (26) are connected to each other, and an insulating resin layer (13) having elasticity which covers the post electrode portions (16A), the projecting electrode portions (20) and the passivation film (19) with the exception of the end faces of the post electrode portions (16A). |
