发明名称 |
Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate |
摘要 |
A method of forming a lead-free solder alloy on an electronic substrate. In the method, a metal stack which includes a thick nickel barrier layer and an outer copper layer is then evaporated or plated with silver and tin. Upon heating to an appropriate temperature, the copper, tin and silver form a lead-free tin, silver, copper solder.
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申请公布号 |
US6596621(B1) |
申请公布日期 |
2003.07.22 |
申请号 |
US20020151075 |
申请日期 |
2002.05.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COPELAND BRUCE ANTHONY;GORRELL REBECCA YUNG;TAKACS MARK ANTHONY;TRAVIS, JR. KENNETH J.;WANG JUN;WIGGINS LOVELL B. |
分类号 |
H01L21/60;H01L23/485;H05K3/24;H05K3/34;(IPC1-7):H01L21/443;H01L21/445 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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