| 摘要 |
PURPOSE: A lead-free composition for the preparation of an aluminum enamelware is provided, which is applied to the inner surface of an aluminum enamelware to improve the tensile strength and the thermal conductivity and to reduce the harmfulness by employing CuO and aluminum oxide instead of a lead-containing material. CONSTITUTION: The lead-free composition comprises the steps of mixing 43 wt% of silicon dioxide, 1-2 wt% of boron oxide, 30 wt% of sodium oxide, 20 wt% of titanium dioxide, 2 wt% of calcium oxide, 0.1 wt% of CuO and 1.5 wt% of aluminum oxide, melting the mixture and injecting the molten one into a cool water to cool it rapidly to form frit; pulverizing the frit by using a common ball mill; and mixing the pulverized frit with water in the ratio of 6:4, and adding 0.2-0.5 wt% of clay, 0.2-2 wt% of boric acid, 2-5 wt% of sodium silicate, 2-5 wt% of silica and 0.3-0.7 wt% of methanol to the mixture to mix them to form slip.
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