发明名称 |
Power semiconductor module |
摘要 |
A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is provided at least on its top side with a structured metalization. The at least one ceramic substrate is fitted with semiconductor components and is inserted into a bottom opening of the plastic housing. The connection elements for the external main connections and control connections are connected by detaching a part of the structured metalization from the at least one ceramic substrate and bending it vertically upward to form a grip tab so that the grip tab can be connected to a connection element through the use of a brazed joint or a welded joint. These measures ensure an excellent stability with regard to fluctuating thermal loads.
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申请公布号 |
US6597585(B2) |
申请公布日期 |
2003.07.22 |
申请号 |
US20010954411 |
申请日期 |
2001.09.17 |
申请人 |
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER GMBH & CO. KG |
发明人 |
FERBER GOTTFRIED;PELMER REIMUND |
分类号 |
H01L25/07;H05K1/03;H05K3/40;(IPC1-7):H05K7/00 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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