发明名称 |
Concave face wire bond capillary and method |
摘要 |
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
|
申请公布号 |
US6595406(B2) |
申请公布日期 |
2003.07.22 |
申请号 |
US20020155317 |
申请日期 |
2002.05.23 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
CHAPMAN GREGORY M.;BETTINGER MICHAEL J.;DUE JENNIFER A. |
分类号 |
B23K20/00;H01L21/603;H01L21/607;(IPC1-7):B23K31/02;B23K37/00 |
主分类号 |
B23K20/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|