发明名称 |
Planar-processing compatible metallic micro-extrusion process |
摘要 |
Micromachined extrusions on the micrometer scale is realized using compressive stresses resulting from electromigration-induced mass transport in planarized conductors. Extrusions are formed through simple die patterns etched through a passivation layer overlaying the conductors.
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申请公布号 |
US6594894(B1) |
申请公布日期 |
2003.07.22 |
申请号 |
US20000578064 |
申请日期 |
2000.05.24 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE |
发明人 |
BERNSTEIN GARY H.;FRANKOVIC RICHARD |
分类号 |
B81C99/00;(IPC1-7):H01R43/02;B21C23/00 |
主分类号 |
B81C99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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