| 发明名称 |
Solder paste and electronic device |
| 摘要 |
A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.
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| 申请公布号 |
US6596094(B2) |
申请公布日期 |
2003.07.22 |
| 申请号 |
US20010993615 |
申请日期 |
2001.11.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
OCHIAI MASAYUKI;YAMAGISHI YASUO;UCHIDA HIROKI;KITAJIMA MASAYUKI;TAKESUE MASAKAZU;SHONO TADAAKI |
| 分类号 |
B23K35/22;B23K35/02;B23K35/26;B23K35/363;C22C13/00;H05K3/34;(IPC1-7):B23K35/363 |
主分类号 |
B23K35/22 |
| 代理机构 |
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代理人 |
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