发明名称 POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To discriminate (detect) the life of a polishing pad without lowering relative rigidity of a groove required for polishing. <P>SOLUTION: This polishing pad 11 provided in a position opposite to a surface plate for placing a material to be polished, has a service life discriminating groove 13 or hole shallower than the depth of a desired polishing groove 12 or hole required for polishing and the polishing groove. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003205451(A) 申请公布日期 2003.07.22
申请号 JP20020000286 申请日期 2002.01.07
申请人 HITACHI LTD 发明人 ITO HIDEFUMI
分类号 B24B37/20;B24B37/24;B24B37/26;H01L21/304 主分类号 B24B37/20
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