| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress the disconnection of electrode caused by a difference in level occurring in contact holes and to obtain stable connection between electrodes by packing a conductive material in contact hole regions including the upper electrodes connected to the lower electrodes. SOLUTION: A planarization film 12 is formed by applying a polyimide resin, acrylic resin, etc., over the entire surface. The contact holes 13 are opened in the planarization film 12 and a transparent conductive thin film of metals, such as Al, or ITO, etc., is deposited thereon so as to be electrically connected to the drain electrodes 11 and is patterned to a prescribed shape, by which the upper electrodes 14 are formed. Next, a conductive layer 15 is formed by a plating method or conductive resin film in the contact hole 13 parts. The constitution to electrically connect the upper electrodes 14 via the contact holes 13 to the drain electrodes 11 of TFTs of the device in such a manner, then to pack the recessed parts occurring in the contact holes 13 by the conductive layer 15 is adopted for the device and, therefore, the surface of the uppermost layer is made flat.</p> |
