发明名称 |
Heat sink assembly |
摘要 |
A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.
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申请公布号 |
US6595275(B1) |
申请公布日期 |
2003.07.22 |
申请号 |
US20020187290 |
申请日期 |
2002.07.02 |
申请人 |
WAFFER TECHNOLOGY CORP.;WANG JACK |
发明人 |
WANG JACK;CHENG CHENG-HUA;LIN MICHAEL;MA CHARLES |
分类号 |
F28F3/02;H01L23/367;(IPC1-7):F28F7/00 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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