发明名称 Heat sink assembly
摘要 A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.
申请公布号 US6595275(B1) 申请公布日期 2003.07.22
申请号 US20020187290 申请日期 2002.07.02
申请人 WAFFER TECHNOLOGY CORP.;WANG JACK 发明人 WANG JACK;CHENG CHENG-HUA;LIN MICHAEL;MA CHARLES
分类号 F28F3/02;H01L23/367;(IPC1-7):F28F7/00 主分类号 F28F3/02
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