| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flame retardancy, high-temperature reliability and soldering heat resistance required for sealing materials for electronic parts. SOLUTION: The composition comprises an epoxy resin, a phenol resin, a hardening accelerator, an inorganic filler, a phosphazene compound and an acid acceptor. COPYRIGHT: (C)2003,JPO
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