发明名称 POLISHING MACHINING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing machining method, capable of providing high polishing removal depth accuracy of a surface to be machined. SOLUTION: In this polishing machining method, a polishing tool is pressed to a surface to be machined, and load is generated in the normal direction of the surface to be machined to perform polishing. In the course of polishing machining, load and the tangential force generated in polishing machining are sensed, and polishing machining condition is determined to attain the ratio of tangential force and load for obtaining a desired polishing removal depth from the relationship between the ratio of the tangential force and load (tangential force/load or load/tangential force) and the ratio of the previously experimentally obtained tangential force and load. According to the polishing machining method, a high accuracy optical element forming die and a high performance optical element formed by it can be obtained, and a high performance laser scanner optical system can be constructed by incorporating the optical element. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003205459(A) 申请公布日期 2003.07.22
申请号 JP20020001362 申请日期 2002.01.08
申请人 RICOH CO LTD 发明人 ENDO HIROYUKI;SAKAE HIDETOSHI
分类号 B24B49/16;B24B13/00;(IPC1-7):B24B49/16 主分类号 B24B49/16
代理机构 代理人
主权项
地址