发明名称 GLASS-IMPREGNATED WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive and high heat-resistant wiring circuit board that can be manufactured using inexpensive materials by a simple manufacturing method. SOLUTION: After a wiring circuit 11 is formed on an insulating layer 10 through which a glass solution of hardened type glass permeates by metal paste by printing, the insulating layer with the wiring circuit formed is impregnated with the glass solution of the hardened type glass. Then, it is hardened to form glass, and a wiring circuit board with excellent heat resistance is manufactured. In the glass-impregnated wiring circuit board, there are two or more layers of insulating layers with the wiring board formed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003204133(A) 申请公布日期 2003.07.18
申请号 JP20020001115 申请日期 2002.01.08
申请人 TOPPAN PRINTING CO LTD 发明人 OKANO TATSUHIRO
分类号 H05K3/28;H05K1/03;H05K3/46;(IPC1-7):H05K1/03 主分类号 H05K3/28
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