| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a resin molding substrate warps due to the difference in thermal expansion between the surface of electronic parts and the surface of solder when the parts are soldered to the substrate. SOLUTION: The resin molding substrate is constituted by coating a metallic frame forming an electronic circuit pattern with a resin, and has a parts surface on which the electronic parts are mounted and a soldered surface to which leads extended from the electronic parts are soldered on the opposite side of the parts surface. In the resin molding substrate, ribs are formed on the parts surface by using the same resin. Consequently, the strength of the substrate increases and the warping of the substrate is prevented when the parts are soldered to the substrate. In addition, since the ribs are formed by insert molding so that the ribs may have long lengths in the directions perpendicular to the directions of injection, the effects of the ribs increase. COPYRIGHT: (C)2003,JPO
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