| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip capacitor which is formed by laminating a folded dielectric sheet, and is coated with electrode paste, and firing, and with which the time and cost required for manufacturing can be reduced. SOLUTION: A laminated structure is formed by laminating an alternately folded dielectric sheet, which is coated with electrode paste on both faces. In particular, the ends of the dielectric sheet are positioned retreating from folded ends formed, by folding the dielectric sheet to form a step at each folded end part. COPYRIGHT: (C)2003,JPO
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