VACUUM ARC VAPOR DEPOSITION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a vacuum arc vapor deposition method by which reduction in film-deposition rate can be suppressed and stable film-deposition rate can be attained. SOLUTION: The vacuum arc vapor deposition method comprises steps of: generating cathode-material plasma by means of arc discharge using a film- deposition raw material as a cathode in an arc source; introducing the cathode- material plasma by means of a magnetic filter to a substrate to be subjected to film deposition; and depositing a film from ions of the cathode-material in the cathode-material plasma. In this method, pressure at the film deposition is made to≤0.01 Pa. COPYRIGHT: (C)2003,JPO