METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to be capable of improving the UPEH(Unit Per Equipment Hour) of the semiconductor package by additionally forming the mark of company name under a molding process. CONSTITUTION: A wafer fabrication is carried out for forming a chip(S100). A wire bonding process is carried out for bonding the chip on a lead frame(S200). A semiconductor package is formed by carrying out a molding process using resin while marking company name on one surface of the semiconductor package(S300). A forming process is carried out for bending a lead exposed from the package(S500). A test is carried out for inspecting the electrical operation state of the package(S700). A marking process is carried out on the surface of the package(S800). An auto inspection is carried out for inspecting the appearance of the package(S900).