| 摘要 |
PURPOSE: A semiconductor wafer processing system having an improved vacuum line connecting structure is provided to be capable of reducing the generation of leak and restraining the generation of particles by using a single type connecting part. CONSTITUTION: A semiconductor wafer processing system having improved vacuum line connecting structure is provided with a process chamber(21) for forming processing space, a vacuum gauge(25) installed at the front portion of a vacuum line(23) for measuring the degree of vacuum of the process chamber, and a single type connecting part(27). At this time, the single type connecting part includes a flange part(27a) connected to the upper surface of the process chamber for connecting the vacuum line and the process chamber, a pipe part(27b) formed at the center portion of the flange part as one piece for connecting the vacuum line. Preferably, a sealing part(29) is installed between the flange part and the process chamber.
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