| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive and high quality structure and a manufacturing method of a heat sink used in a semiconductor device with an exposed heat sink. <P>SOLUTION: The semiconductor device with the heat sink comprises: a semiconductor element 3 disposed within a space formed by leads of a lead frame 1, the semiconductor element having bonding pads connected to the leads through wires 5 respectively; a convex heat sink 4a made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads, the semiconductor element 3 being disposed directly at a center portion; an insulator 2 disposed on the leads and for bonding and fixing the semiconductor element to the heat sink; and a package 6 of resin for sealing except a part of the leads and the top surface of a projecting portion of the heat sink. The insulator 2 has a shape like a tape so as to cover a part of the leads and extend along an inner side face in contact with an outer peripheral end edge of the heat sink 4, the projecting portion peak part of the heat sink 4 is larger than the minimum area of the side face part and the side face part is scraped out. <P>COPYRIGHT: (C)2003,JPO |
