发明名称 METHOD FOR MANUFACTURING HOLDING PLATE USED FOR COATING EXTERNAL ELECTRODE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent a holding plate from attaching with polishing dust and prevent clogging of a polishing material, by reducing the stickiness of a plastic molding body. SOLUTION: A method for manufacturing holding plate comprises (A) a process for obtaining the holding plate 1, by inserting a core plate 5 of metal or the like having rigidity, into a metal mold and forming a silicone rubber molding body 7; (B) a process for subjecting the holding plate 1 to heat treatment; (C) a process for having radiation rays irradiated to the holding plate which has been treated by heat; and (D) a process for polishing the surface of the silicone rubber molding body 7 of the holding plate 1, which has been irradiated with radiation rays. The kind of radiation ray should preferably be ultraviolet rays. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003203830(A) 申请公布日期 2003.07.18
申请号 JP20020003340 申请日期 2002.01.10
申请人 SHIN ETSU POLYMER CO LTD 发明人 KOMORI ATSUSHI
分类号 H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G13/00
代理机构 代理人
主权项
地址