发明名称 SEMICONDUCTOR WAFER ETCHING APPARATUS BY WET STATION
摘要 PURPOSE: A semiconductor wafer etching apparatus by a wet station is provided to be capable of uniformly etching a wafer when conserving the wafer in a bath filled with chemicals by using a wafer rotating part. CONSTITUTION: A semiconductor wafer etching apparatus is provided with a bath(13) capable of storing chemicals(11), a boat(15) installed in the bath(13) for loading a plurality of wafers(W), and a wafer rotating part(20) installed at the lower portion of the boat for rotating the wafers loaded on the boat(15). Preferably, a rotating bar(21) used as the wafer rotating part(20), is installed across the inner portion of the bath(13) for simultaneously rotating a plurality of wafers. At this time, the rotating bar(21) contacts edge portions of the wafers.
申请公布号 KR20030061142(A) 申请公布日期 2003.07.18
申请号 KR20020001529 申请日期 2002.01.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, HEON JU;KIM, SUN HO;LEE, DEOK YEOL
分类号 H01L21/3063;(IPC1-7):H01L21/306 主分类号 H01L21/3063
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