发明名称 |
SEMICONDUCTOR WAFER ETCHING APPARATUS BY WET STATION |
摘要 |
PURPOSE: A semiconductor wafer etching apparatus by a wet station is provided to be capable of uniformly etching a wafer when conserving the wafer in a bath filled with chemicals by using a wafer rotating part. CONSTITUTION: A semiconductor wafer etching apparatus is provided with a bath(13) capable of storing chemicals(11), a boat(15) installed in the bath(13) for loading a plurality of wafers(W), and a wafer rotating part(20) installed at the lower portion of the boat for rotating the wafers loaded on the boat(15). Preferably, a rotating bar(21) used as the wafer rotating part(20), is installed across the inner portion of the bath(13) for simultaneously rotating a plurality of wafers. At this time, the rotating bar(21) contacts edge portions of the wafers.
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申请公布号 |
KR20030061142(A) |
申请公布日期 |
2003.07.18 |
申请号 |
KR20020001529 |
申请日期 |
2002.01.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, HEON JU;KIM, SUN HO;LEE, DEOK YEOL |
分类号 |
H01L21/3063;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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地址 |
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